The 6th AMI international conference on thin wall packaging will take place on May 23-24, 2017 at The Westin Chicago North Shore in Chicago, IL, USA. Located in the heart of the packaging industry, attendees will participate in second-to-none networking and experience a compelling conference program.
Thin Wall Packaging 2017 will offer a unique networking opportunity for leading food companies, retailers, packaging manufacturers, researchers, and suppliers of the industry to debate the latest developments and market trends in light weight plastics packaging. In
conjunction to the conference, Intertek will host a food packaging safety and
regulatory compliance seminar
on May 25th. For more information, click here.
further information on this conference, please contact Amanda Schaeffer,
Sr. Conference Coordinator at email@example.com or call +1 610 478