After a successful first event in 2016, AMI is pleased to announce the second edition of the Thin Wall Packaging Asia event, which will take place from 18-19 September 2017 in Singapore.
Thin Wall Packaging
Asia 2017 is aimed at the value chain participants in the
thermoformed and injection moulded packaging. The growth of organised retail in
Asia as well as more formalised approach to product branding will have a
significant impact on packaging demand in the region. The industry is in need
of a clearer definition to facilitate the change.
The new requirements are
expected to drive the development of fast-cycle lightweight packaging, barrier
packaging for long-life products and packaging with superior decoration (IML).
Thin wall plastic packaging like tubs, cups, pots, trays and clamshells,
provides a means of supplying consumer appeal, convenience and product
For further information on this conference, please contact Maud Lassara on: Email: email@example.com Tel: +44 (0) 117 314 8111.