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International business and technology conference for the specialty flexible packaging industry

27-28 June 2017, Chicago Marriott O'Hare, Chicago, IL

Organized by Applied Market Information LLC (AMI)

MITSUI CHEMICALS AMERICA, INC.
BOSTIK, INC., ARKEMA GROUP
ENTEC POLYMERS
THERMO FISHER SCIENTIFIC
AMI’s 8th North American conference on Multilayer Packaging Films covered a range of current technical and commercial issues including new films and materials, barrier properties and testing, production technology (such as coextrusion and coating), applications and markets. 

Multilayer Packaging Films 2017 took place on June 27-28 at the ​Chicago Marriott O'Hare in the beautiful city of Chicago, at the center of the packaging industry.

This conference provided an international forum for all companies involved in the manufacture and specification of film packaging, be they brand owners, manufacturers, converters or suppliers. It will offer an opportunity to network with professionals from the flexible packaging industry and to keep up to date with the latest developments and market trends.

For further information on this conference, please contact Ms. Amanda Schaeffer, Sr. Conference Coordinator at as@amiplastics-na.com or call +1 610 478 0800.

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